SK hynix is officially building a new advanced packaging facility in West Lafayette, Indiana, USA with an investment of around $3.87 billion. The South Korean memory giant will build next-gen HBM ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image ...

SK hynix will be building its next advanced packaging fabrication site alongside an R&D facility in West Lafayette, Indiana. The company will be investing $3.87 billion in the project where it will be ...

TL;DR: SK hynix VP Lee Kang-wook emphasized at Semicon Korea 2024 that advanced packaging is crucial for semiconductor innovation and business opportunities, shifting from enhancing product value to ...

SK hynix, the world's second-largest maker of memory chips, said Monday that it will focus on developing advanced packaging technologies for next-generation high bandwidth memory (HBM), aiming to ...

SEOUL, April 3 (Reuters) - SK Hynix (000660.KS), opens new tab, the world's second-largest memory chip maker, said on Wednesday it will invest around $3.87 billion to build an advanced packaging plant ...

SK Hynix has confirmed earlier reports that it will build an advanced chip packaging facility in West Lafayette, Indiana. The South Korean chip manufacturer said on April 3 that it plans to invest ...